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We offer over 220 alloys with melting temperatures ranging from 7–1,064°C. Our products are focused on six main alloy families: gallium (Ga), bismuth (Bi), indium (In), tin (Sn), lead (Pb), and gold (Au).
Indium Corporation's "Power-Safe" NC-SMQ75 is the only solder paste suitable for use in non-cleaned clip-bonded applications in power semiconductor die-attach assemblies. NC-SMQ75 is an ultra-low residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable residue of approximately 0.4 weight percent ...
Soldering is a technique to attach surfaces together using metal fillers (solders) which melt below 350ºC. • A solder joint is the result of an intermetallic formation between the elements of the low temperature solder (typically some mixture of tin, lead, silver, bismuth, gold, indium or copper) and the substrate metallization being soldered.
The malleability of indium minimizes surface resistance and increases heat flow (conductance). Our patented Heat-Spring ® technology further reduces the thermal …
Indium Corporation's m2TIM TM combines liquid metal with a solid metal preform. The presence of a solid solder preform absorbs and contains the liquid alloys while improving thermal conductivity. ... Extraordinary wetting ability to both metallic and non-metallic surfaces; Extremely low interfacial resistance at surfaces; Eliminated risk of ...
Indium metal will compensate for these imperfections without the need for reflow. The cleanliness of the indium is critical for sealing applications. Indium is self-passivating and forms 80-100 angstroms of oxide on its surface. If the oxide is not fully removed, it can be a source of leakage when it becomes compressed within the seal.
Solder Alloys. Since our founding in 1934, Indium Corporation has been the world's leader in specialty solders and alloy development. Our R&D staff, including several Ph.D. metallurgists, work with our core set of metals to develop alloys that will address the latest soldering and sealing challenges. Our alloy selection is based on decades of ...
Semiconductor Flux. Ball-Attach Flux WS-788. Features Halogen-free Air refl ow Designed for Pb-Free applications Excellent solderability on a variety of surfaces Water wash Bubble-free packaging Flux rheology applicable for spheres 50-762microns Uniform pin-transfer over extended periods Red color for ease of detection Introduction Ball-Attach ...
Like indium, gallium and gallium alloys have the ability to wet to many non-metallic surfaces such as glass and quartz. Gently rubbing the gallium alloy onto the surface may help induce wetting. Note: These alloys form a thin, dull-looking oxide skin that is easily dispersed with mild agitation. The oxide-free surfaces are bright and lustrous.
Indium, the 49th element, was discovered in Germany in 1863. In 1934, Indium Corporation of America was the first to begin commercial development of indium, and is still the leading refiner, fabricator, and marketer of this versatile silver-white metal. Indium is used in a wide variety of applications, based on its unique attributes.
Indium Corporation Subject: As a sacial heat source in soldering applications, NanoFoil® eliminates the need for an oven or furnace and is able to bond surfaces that have CTE mismatch. After the reaction, NanoFoil® becomes a non-functional part of the solder joint. Na noFoil® can also be used as a reaction initiator in standard sheet form.
Soldering Products manufactured by Indium Corporation include: Solder paste and powders, metals, solar assembly materials, solders, flux and epoxies, inorganic …
Indium compensates for these differences. Indium cold welds to itself so you can apply an indium coating to two surfaces like glass, quartz or certain ceramics that cannot be soldered and cold weld them together. So if you have a hermetic sealing requirement or you are just looking to join two dissimilar metals together, take a look at …
Indium Corporation is the leader in power electronics assembly materials. A variety of industries including automotive, transportation, computing, and energy infrastructure (i.e., power grids), are demanding more and more …
There is a lot of interest in plating indium bumps and other fine features onto wafers and other substrates. And the desired bump size and pitch is ever decreasing. Here's what you need to know. When we selectively plate indium onto exact locations, the surface of the work-piece is typically masked (holes in the mask at the locations where the indium is …
All of Indium Corporation s solder paste and preform manufacturing facilities are IATF 16949:2016 certi ed. Indium Corporation is an ISO 9001:2015 registered company. ... When applied as a coating to glass, mylar, or other transparent surfaces, indium oxide and indium-tin oxide (ITO) create conductive, highly transparent surfaces, which reflect ...
Description. TACFlux® 483 is a no-clean flux formulated for SnPb solders. TACFlux® 483 provides excellent wetting (Air or Nitrogen atmosphere) to many surfaces, including Ni. Its many uses include rework/repair and SMT component attach (including BGA and Flip-Chip). A minimum reflow temperature of approximately 200°C (dependent on reflow ...
As some of us can attest – solder can be difficult to use even on certain metallic surfaces! Although that is true for most alloys, Indium has a unique ability to bond to some non-metallic surfaces like …
Indium Corporation has been making seals since 1934. We manufacture flat gaskets or pure indium wire so you can form the gasket yourself. Wire is most often used when one of the surfaces is a channel …
Good wetting, even on oxidized Cu OSP surfaces; Consistent flux deposition with dipping, , and pin transfer applications; High tackiness to hold die or spheres in place ... Indium Corporation's Ball …
Indium Corporation is quickly becoming known as one of the highest quality, full line suppliers of flux-cored wire solder. Indium Corporation uses only "conflict-free" and grade A (per ASTM B32) metals, as well as other high purity metals for its flux-cored wire. Our materials have been tested and certified to meet IPC J-STD-004C and other ...
Indium Corporation's Indium8.9HF is an ultra-reliable, void-reducing solder paste for automotive applications. It meets HKMC MS184-01 (Type B) testing criteria, which is one of the automotive industry's most stringent reliability criteria. Contact us to find out more about our other products that also meet HKMC MS184-01 (Type B) testing ...
Indium Corporation's suite of proven, high-reliability materials, from solder paste to solder preforms, thermal interface materials, innovative solder alloys, metals, and compounds offers enhanced performance in …
Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes. The oxidation-inhibiting properties of Indium10.1 solder pastes promote industry-leading head-in-pillow and graping resistance, with complete coalescence, even after ...
Indium Corporation offers liquid alloys that remain liquid at room temperatures. The gallium liquid alloys are used in many applications including thermal management, printable alloys, sensors, and more. ...
Indium Corporation is the leader in power electronics assembly materials. A variety of industries including automotive, transportation, computing, and energy infrastructure (i.e., power grids), are demanding more and more from power electronics (power semiconductor) systems. As this trend continues, it is critical that we continue to research ...
If the vibration frequencies don't match up, heat transfer is interrupted at each interface within the TIM. Using a conductive metal (like indium) avoids that issue altogether." Bob concluded, "The indium foil eliminates pump-out since it is solid. However, it doesn't flow between the mating surfaces like a liquid or gel does.
Indium Corporation is the leading manufacturer and supplier for package-attach soldering materials and thermal interface materials. Technical. Documents. Emerging use cases for power electronics with SiC semiconductor technology are driving the need for advanced cooling systems. Traditional thermal interface materials simply cannot support the ...
Specialty Solder Spheres. Indium Corporation is a supplier of specialty solder and brazing spheres in small to mid-size volumes. We offer a wide variety of alloys and sizes from around 0.004" (100 microns) to 0.078" …
Indium Corporation manufactures NanoFoil ... Au, or Cu surfaces. Solder and many standard epoxy-silver materials are proving increasingly unsuitable for many discrete and small module device applications. They may, for example, be incapable of surviving the ambient conditions seen from longer mission profiles for automotive applications. These ...
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